Huawei to showcase industry’s fastest LTE TDD Multi-mode Chipset at GSMA Mobile Asia Congress

Huawei, a global information and communications technology (ICT) solutions provider, today announced that it will showcase the world’s first multi-mode terminal chip solution based on 3GPP R9 at the 2011 GSMA Mobile Asia Congress in Hong Kong.

Huawei’s multi-mode solution represents a new milestone in the maturing of the LTE industry and demonstrates the convergence of LTE TDD (Time Division Duplexing) and FDD (Frequency Division Duplexing), accelerating the realization of global LTE TDD/FDD roaming services.

The chipset is a game changer for operators since the availability of high performance multi-mode LTE terminals is a prerequisite to attracting high value mobile broadband subscribers.

The key product in this multi-mode solution, Balong 710, is the baseband processor chip Hi6920, which is the industry’s first chip with the ability to support LTE R9. Previously, chips were only able to support 3GPP R8. Huawei’s Hi6920 is the fastest multi-mode chip that supports the complete range of standards: LTE TDD/FDD/TD-SCDMA/UMTS/GSM/EDGE/GPRS. Based on industry-leading technologies such as dual-layer Beamforming and MIMO (Multiple Input Multiple Output), Hi6920 brings users the best experience and highest downlink data rates of up to150Mb/s.

In addition to Balong 710, Huawei will also showcase other multi-mode terminal devices, including the mobile WiFi device E598.