Sierra Wireless introduces new LTE wireless modules

Sierra Wireless AirPrime MC Series intelligent embedded modules headline Sierra Wireless’ new LTE portfolio; modules available for all major network technologies provide a global solution for device manufacturers and a superior end-customer experience

Sierra Wireless has announced the launch of a suite of new products designed for LTE networks that will provide users wireless access at download speeds of up to 100 megabits per second (Mbps) and upload speeds up to 50 Mbps.

The Sierra Wireless portfolio will support all major network technologies and offer compatibility with existing 2G and 3G services.

Leading Sierra Wireless’ new LTE product launch are three additions to the AirPrime MC Series of Intelligent Embedded Modules: the AirPrime MC7750; MC7700; and MC7710. The three variants offer different network technology and frequency band combinations, as well as support for both Linux and Windows, allowing manufacturers to develop products once and easily repurpose that development work for other regions and customers.

The AirPrime MC7750 module supports LTE, EV-DO and HSPA+ networks, while the AirPrime MC7700 and MC7710 modules support LTE and HSPA+ in different frequency bands.

The new AirPrime MC Series embedded modules allow manufacturers to take advantage of the latest generation of high speed mobile networks, delivering up to 100 Mbps download speeds and 50 Mbps upload speeds, integrated GPS capabilities, and broader compatibility than previous technologies. Compatibility with existing 2G and 3G networks ensures users stay connected whether they’re in major cities or travelling across the country, and supports international roaming.

The Sierra Wireless AirPrime MC series modules for LTE networks also support Qualcomm’s Gobi API. This interface helps streamline integration efforts, spur application development among third party developers, and delivers greater flexibility to device manufacturers.

“Sierra Wireless’ new wireless modules use our industry-leading, multimode 3G/LTE MDM9200TM and MDM9600TM integrated chipsets to provide broadband connectivity via a wide range of mobile network technologies, including 2G, 3G and LTE networks,” said Fram Akiki, senior director of product management with Qualcomm CDMA Technologies. “Furthermore, these chipsets are compatible with Qualcomm’s Gobi API in order to deliver support for a growing ecosystem of software providers’ solutions for connectivity, location, and manageability, giving consumers new ways to leverage their mobile broadband connections.”